Modeling Electrowetting on Dielectric for Novel Droplet-Based Microactuation
Recent advancements in Electrowetting on Dielectric (EWOD) systems, such as simplified fabrication, low-voltage actuation, and the development of more reliable materials, are expanding the potential applications of electrowetting actuators. One application of EWOD actuators is in RF devices to enabl...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-12-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/15/12/1491 |
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| Summary: | Recent advancements in Electrowetting on Dielectric (EWOD) systems, such as simplified fabrication, low-voltage actuation, and the development of more reliable materials, are expanding the potential applications of electrowetting actuators. One application of EWOD actuators is in RF devices to enable dynamic reconfiguration and allow real-time adjustments to frequency and bandwidth. In this paper, a method is introduced to actuate a panel using EWOD forces. In the EWOD system, the velocity of the plate increases by maximizing the actuation force, minimizing the moving mass (droplets and metalized plate), and reducing resistance (contact line drag, fluid drag). However, some of these are competing factors. For instance, the actuation force can be increased by increasing the number of droplets, but this also increases the inertia and the drag force. An analytical model of EWOD actuation is presented to understand system performance tradeoffs. The model is validated with an EWOD experiment, and the data demonstrate less than a 7.8% error between the measured and predicted maximum plate velocities for different voltage inputs. In addition, this study presents a 3D numerical FEM model to analyze the velocity profile and viscous force in the thin droplets, focusing on variations along the droplet’s height, which cannot be captured experimentally. The main advantage of the proposed system over previous works is the simple 2D manufacturing process, which allows embedding metalized plates and RF circuit boards, in addition to being compact, portable, and low-cost. In addition, the proposed method does not have any mechanical components, which can increase the system’s reliability in a harsh environment. |
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| ISSN: | 2072-666X |