Comprehensive optimization of selective laser melting process parameters for microstructure, density, hardness, and tribological performance of pure copper
This study is concerned with the optimisation of the processing parameters for the selective laser melting (SLM) of pure copper. The influence of these parameters on the microstructure, density and mechanical properties of copper samples produced by SLM is investigated in detail. Taguchi analysis is...
Saved in:
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
International Institute for the Science of Sintering, Beograd
2024-01-01
|
| Series: | Science of Sintering |
| Subjects: | |
| Online Access: | https://doiserbia.nb.rs/img/doi/0350-820X/2024/0350-820X2400007O.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | This study is concerned with the optimisation of the processing parameters for the selective laser melting (SLM) of pure copper. The influence of these parameters on the microstructure, density and mechanical properties of copper samples produced by SLM is investigated in detail. Taguchi analysis is used to assess the importance of key building parameters including layer thickness, laser spot size and hatch distance on density. In addition, ANOVA is used to describe the contribution of each parameter to the density. The results reveal that layer thickness is the most effective parameter on density with an impact rate of 88.86%. Contrary to this situation, it appears that the effect of laser spot size and hatch distance on the density is quite limited, with an impact rate of 2.57% and 0.10%, respectively. Optimum results, including a relative density of 95.4% and a hardness of 63 HV, are achieved under specific parameters: a layer thickness of 0.03 mm, a hatch distance of 110 mm and a laser spot size of 70 μm. This study provides a valuable insight into SLM processing of pure copper and offers practical recommendations for optimising the parameters used. |
|---|---|
| ISSN: | 0350-820X 1820-7413 |