Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element

The thermal property of diamond/metal composites mainly depends on the chemical bonding and structure of interfacial layers between two heterogeneous materials. To improve the thermal property of the diamond/metal composites, a metallic carbide layer that bridging both crystal structure and thermal...

Full description

Saved in:
Bibliographic Details
Main Authors: Yizhe Cao, Bo Li, Lei Liu, Shaolong Li, Dongxu Hui, Shaodi Wang, Huiying Liu, Xin Li, Xin Zhang, Shengyin Zhou, Shufeng Li
Format: Article
Language:English
Published: Elsevier 2024-11-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785424025201
Tags: Add Tag
No Tags, Be the first to tag this record!