Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element
The thermal property of diamond/metal composites mainly depends on the chemical bonding and structure of interfacial layers between two heterogeneous materials. To improve the thermal property of the diamond/metal composites, a metallic carbide layer that bridging both crystal structure and thermal...
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| Main Authors: | Yizhe Cao, Bo Li, Lei Liu, Shaolong Li, Dongxu Hui, Shaodi Wang, Huiying Liu, Xin Li, Xin Zhang, Shengyin Zhou, Shufeng Li |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424025201 |
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