Cao, Y., Li, B., Liu, L., Li, S., Hui, D., Wang, S., . . . Li, S. Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element. Elsevier.
Chicago Style (17th ed.) CitationCao, Yizhe, et al. Quantitative Control of Interfacial Structure and Thermal Conductivity Between Diamond and Copper via Thermal Diffusion of Alloying Element. Elsevier.
MLA (9th ed.) CitationCao, Yizhe, et al. Quantitative Control of Interfacial Structure and Thermal Conductivity Between Diamond and Copper via Thermal Diffusion of Alloying Element. Elsevier.
Warning: These citations may not always be 100% accurate.