Dynamics of molten pool evolution and high-speed real-time optical measurement in laser polishing
Laser polishing (LP) is considered an effective method for generating ultrasmooth surfaces owing to its precision, flexibility, and material compatibility. However, a lack of understanding of the evolution of surface topography during LP significantly limits the achievable surface roughness in pract...
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| Main Authors: | , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Light Publishing Group
2024-08-01
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| Series: | Light: Advanced Manufacturing |
| Subjects: | |
| Online Access: | https://www.light-am.com/article/doi/10.37188/lam.2024.050 |
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| Summary: | Laser polishing (LP) is considered an effective method for generating ultrasmooth surfaces owing to its precision, flexibility, and material compatibility. However, a lack of understanding of the evolution of surface topography during LP significantly limits the achievable surface roughness in practice. In this work, for the first time, by employing optical time-stretch quantitative interferometry (OTS-QI), we recorded the entire evolution of surface topography during LP with nanosecond-level temporal resolution, providing insight into the mechanisms involved in the surface roughness evolution, such as the Marangoni effect and the formation mechanism of mid-frequency waviness (MFW). Assisted by numerical calculations, we reveal that a ‘perfect polishing point’ exists, i.e., the optimal interaction time for LP at a specific laser power density, at which the surface roughness can be minimised without the formation of an MFW owing to the Marangoni effect and non-uniform removal. This OTS-QI system harnesses the rapid repetition rate of femtosecond lasers, achieving a remarkable measurement speed exceeding 100,000,000 times per second while preserving a measurement accuracy comparable to that of existing white light interferometers (WLIs), setting a new benchmark as the fastest recorded roughness measurement. In addition to LP, the proposed method can be applied for real-time and in situ monitoring of many machining scenarios involving highly dynamic phenomena. |
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| ISSN: | 2689-9620 |