Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate
The Cu/Pd bimetallic system electrodeposited on boron-doped diamond (BDD) films for application, as electrode material in the electrochemical reduction of nitrate was studied. The electrochemical behavior of Cu, Pd, and Cu/Pd bimetallic system was evaluated by cyclic voltammetry. From these results,...
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| Format: | Article |
| Language: | English |
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Wiley
2012-01-01
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| Series: | International Journal of Electrochemistry |
| Online Access: | http://dx.doi.org/10.1155/2012/213420 |
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| author | Jorge T. Matsushima Valéria C. Fernandes Andrea B. Couto Maurício R. Baldan Neidenêi G. Ferreira |
| author_facet | Jorge T. Matsushima Valéria C. Fernandes Andrea B. Couto Maurício R. Baldan Neidenêi G. Ferreira |
| author_sort | Jorge T. Matsushima |
| collection | DOAJ |
| description | The Cu/Pd bimetallic system electrodeposited on boron-doped diamond (BDD) films for application, as electrode material in the electrochemical reduction of nitrate was studied. The electrochemical behavior of Cu, Pd, and Cu/Pd bimetallic system was evaluated by cyclic voltammetry. From these results, the formation of the Cu/Pd composite was verified. In addition, Cu with different phases and a Cu/Pd phase in the composite were obtained. Morphological analysis by scanning electron microscopy (SEM) revealed a homogeneous distribution of Cu/Pd bimetallic particles with intermediary dimensions compared to those observed in Cu or Pd electrodeposits separately. These composites were tested as electrocatalysts for nitrate reduction in Britton-Robinson buffer solution (pH 9). Electrochemical measurements showed that composites with higher Cu content displayed the best electrocatalytic activity for nitrate reduction, and the Cu/Pd phase in the bimetallic system served to improve the Cu adherence on BDD electrode. |
| format | Article |
| id | doaj-art-2f27cf610ef34b0f8fca74d2117b45e8 |
| institution | Kabale University |
| issn | 2090-3529 2090-3537 |
| language | English |
| publishDate | 2012-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | International Journal of Electrochemistry |
| spelling | doaj-art-2f27cf610ef34b0f8fca74d2117b45e82025-08-20T03:55:16ZengWileyInternational Journal of Electrochemistry2090-35292090-35372012-01-01201210.1155/2012/213420213420Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of NitrateJorge T. Matsushima0Valéria C. Fernandes1Andrea B. Couto2Maurício R. Baldan3Neidenêi G. Ferreira4Laboratório Associado de Sensores e Materiais (LAS), Instituto Nacional de Pesquisas Espaciais—INPE, 12.245-970 São José dos Campos, SP, BrazilInstituto de Pesquisa Energéticas e Nucleares—IPEN, Centro de Células a Combustível e Hidrogénio (CCCH), 05508-000 São Paulo, SP, BrazilLaboratório Associado de Sensores e Materiais (LAS), Instituto Nacional de Pesquisas Espaciais—INPE, 12.245-970 São José dos Campos, SP, BrazilLaboratório Associado de Sensores e Materiais (LAS), Instituto Nacional de Pesquisas Espaciais—INPE, 12.245-970 São José dos Campos, SP, BrazilLaboratório Associado de Sensores e Materiais (LAS), Instituto Nacional de Pesquisas Espaciais—INPE, 12.245-970 São José dos Campos, SP, BrazilThe Cu/Pd bimetallic system electrodeposited on boron-doped diamond (BDD) films for application, as electrode material in the electrochemical reduction of nitrate was studied. The electrochemical behavior of Cu, Pd, and Cu/Pd bimetallic system was evaluated by cyclic voltammetry. From these results, the formation of the Cu/Pd composite was verified. In addition, Cu with different phases and a Cu/Pd phase in the composite were obtained. Morphological analysis by scanning electron microscopy (SEM) revealed a homogeneous distribution of Cu/Pd bimetallic particles with intermediary dimensions compared to those observed in Cu or Pd electrodeposits separately. These composites were tested as electrocatalysts for nitrate reduction in Britton-Robinson buffer solution (pH 9). Electrochemical measurements showed that composites with higher Cu content displayed the best electrocatalytic activity for nitrate reduction, and the Cu/Pd phase in the bimetallic system served to improve the Cu adherence on BDD electrode.http://dx.doi.org/10.1155/2012/213420 |
| spellingShingle | Jorge T. Matsushima Valéria C. Fernandes Andrea B. Couto Maurício R. Baldan Neidenêi G. Ferreira Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate International Journal of Electrochemistry |
| title | Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate |
| title_full | Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate |
| title_fullStr | Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate |
| title_full_unstemmed | Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate |
| title_short | Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate |
| title_sort | investigation of a cu pd bimetallic system electrodeposited on boron doped diamond films for application in electrocatalytic reduction of nitrate |
| url | http://dx.doi.org/10.1155/2012/213420 |
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