Growth behavior of fatigue cracks in ultrafine grained Cu smooth specimens with a small hole

Growth behavior of fatigue cracks in ultrafine grained Cu smooth specimens with a small hole

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In order to study the growth mechanism of fatigue cracks in ultrafine grained copper, stresscontrolled fatigue tests of round-bar specimens with a small blind hole as a crack starter were conducted. The hole was drilled on the surface where an intersection between the shear plane of the final ECAP...

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Bibliographic Details
Main Authors:	Masahiro Goto, Kakeru Morita, Junichi Kitamura, Takaei Yamamoto, Masataka Baba, Seung-zeon Han, Sangshik Kim
Format:	Article
Language:	English
Published:	Gruppo Italiano Frattura 2015-10-01
Series:	Fracture and Structural Integrity
Subjects:	Fatigue Ultrafine grain Copper Crack propagation Grain coarsening Stress intensity factor
Online Access:	http://www.gruppofrattura.it/pdf/rivista/numero34/numero_34_art_48.pdf
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