Characterization of Electrically Conductive Adhesives to Enable Perovskite-Silicon Tandem Solar Cell Interconnection
The mechanical stability of interconnections in solar modules is crucial for their long-term performance. Electrically conductive adhesives (ECAs) offer a promising solution for the interconnection of perovskite-silicon tandem (PVST) solar cells due to their low-temperature processibility. In this...
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TIB Open Publishing
2025-01-01
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| Series: | SiliconPV Conference Proceedings |
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| Online Access: | https://www.tib-op.org/ojs/index.php/siliconpv/article/view/1407 |
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| author | Leonhard Böck Torsten Rößler |
| author_facet | Leonhard Böck Torsten Rößler |
| author_sort | Leonhard Böck |
| collection | DOAJ |
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The mechanical stability of interconnections in solar modules is crucial for their long-term performance. Electrically conductive adhesives (ECAs) offer a promising solution for the interconnection of perovskite-silicon tandem (PVST) solar cells due to their low-temperature processibility. In this study, the influence of low curing temperatures on the mechanical and electrical properties of ECAs was investigated to assess their suitability for PVST technology. Four commercially available ECAs were characterized, focusing on curing temperatures of 100 °C, 140 °C, and 180 °C. Mechanical characterization through tensile tests and dynamic mechanical analysis (DMA) revealed varying Young’s modulus (E) (stiffness) and glass transition temperatures (TG) among the ECAs. Electrical characterization showed that lower curing temperatures generally led to lower volume resistivity, particularly for ECA C. However, joint resistance values exhibited high standard deviations. Void analysis indicated that void formation had a negligible effect on the mechanical properties of ECAs. Furthermore, the influence of curing degree on mechanical and electrical properties was investigated, highlighting the importance of complete curing for achieving desired properties. Overall, this study provides valuable insights into optimizing the interconnection process for PVST solar cells, essential for enhancing the long-term stability and performance of solar modules
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| format | Article |
| id | doaj-art-2c5f58a14b2f4afb81a261f207cf72c2 |
| institution | Kabale University |
| issn | 2940-2123 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | TIB Open Publishing |
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| series | SiliconPV Conference Proceedings |
| spelling | doaj-art-2c5f58a14b2f4afb81a261f207cf72c22025-01-10T09:49:17ZengTIB Open PublishingSiliconPV Conference Proceedings2940-21232025-01-01210.52825/siliconpv.v2i.1407Characterization of Electrically Conductive Adhesives to Enable Perovskite-Silicon Tandem Solar Cell InterconnectionLeonhard Böck0https://orcid.org/0009-0000-7079-1336Torsten Rößler1https://orcid.org/0000-0002-9297-6136Fraunhofer Institute for Solar Energy SystemsFraunhofer Institute for Solar Energy Systems The mechanical stability of interconnections in solar modules is crucial for their long-term performance. Electrically conductive adhesives (ECAs) offer a promising solution for the interconnection of perovskite-silicon tandem (PVST) solar cells due to their low-temperature processibility. In this study, the influence of low curing temperatures on the mechanical and electrical properties of ECAs was investigated to assess their suitability for PVST technology. Four commercially available ECAs were characterized, focusing on curing temperatures of 100 °C, 140 °C, and 180 °C. Mechanical characterization through tensile tests and dynamic mechanical analysis (DMA) revealed varying Young’s modulus (E) (stiffness) and glass transition temperatures (TG) among the ECAs. Electrical characterization showed that lower curing temperatures generally led to lower volume resistivity, particularly for ECA C. However, joint resistance values exhibited high standard deviations. Void analysis indicated that void formation had a negligible effect on the mechanical properties of ECAs. Furthermore, the influence of curing degree on mechanical and electrical properties was investigated, highlighting the importance of complete curing for achieving desired properties. Overall, this study provides valuable insights into optimizing the interconnection process for PVST solar cells, essential for enhancing the long-term stability and performance of solar modules https://www.tib-op.org/ojs/index.php/siliconpv/article/view/1407Electrically Conductive Adhesive (ECA)Perovskite-Silicon-Tandem Solar CellsLow-Temperature Curing |
| spellingShingle | Leonhard Böck Torsten Rößler Characterization of Electrically Conductive Adhesives to Enable Perovskite-Silicon Tandem Solar Cell Interconnection SiliconPV Conference Proceedings Electrically Conductive Adhesive (ECA) Perovskite-Silicon-Tandem Solar Cells Low-Temperature Curing |
| title | Characterization of Electrically Conductive Adhesives to Enable Perovskite-Silicon Tandem Solar Cell Interconnection |
| title_full | Characterization of Electrically Conductive Adhesives to Enable Perovskite-Silicon Tandem Solar Cell Interconnection |
| title_fullStr | Characterization of Electrically Conductive Adhesives to Enable Perovskite-Silicon Tandem Solar Cell Interconnection |
| title_full_unstemmed | Characterization of Electrically Conductive Adhesives to Enable Perovskite-Silicon Tandem Solar Cell Interconnection |
| title_short | Characterization of Electrically Conductive Adhesives to Enable Perovskite-Silicon Tandem Solar Cell Interconnection |
| title_sort | characterization of electrically conductive adhesives to enable perovskite silicon tandem solar cell interconnection |
| topic | Electrically Conductive Adhesive (ECA) Perovskite-Silicon-Tandem Solar Cells Low-Temperature Curing |
| url | https://www.tib-op.org/ojs/index.php/siliconpv/article/view/1407 |
| work_keys_str_mv | AT leonhardbock characterizationofelectricallyconductiveadhesivestoenableperovskitesilicontandemsolarcellinterconnection AT torstenroßler characterizationofelectricallyconductiveadhesivestoenableperovskitesilicontandemsolarcellinterconnection |