Performance Enhancements of Fully Inkjet-Printing Technology for Antenna-in-Package and Substrate Integrated Waveguides
A fully inkjet-printing technology is applied to antenna-in-package (AiP) and substrate integrated waveguide (SIW) to enhance the performance of three components, including via holes, wire bonding, and flexible antenna arrays. First of all, earlier studies utilize shorting pins for the conductive pa...
Saved in:
| Main Authors: | Yen-Sheng Chen, Sheng-Xue Huang |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
2022-01-01
|
| Series: | International Journal of Antennas and Propagation |
| Online Access: | http://dx.doi.org/10.1155/2022/9967438 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
A Comprehensive Guide to Fully Inkjet‐Printed IGZO Transistors
by: Lorenzo Magnarin, et al.
Published: (2025-04-01) -
A Substrate Integrated Waveguide Slotted Antenna
by: V. G. Koshkid’ko, et al.
Published: (2023-10-01) -
Miniature Dual-Band Substrate Integrated Waveguide Slotted Antenna Array for Millimeter-Wave 5G Applications
by: Fei-Peng Lai, et al.
Published: (2020-01-01) -
Fully Inkjet-Printed Flexible Graphene–Prussian Blue Platform for Electrochemical Biosensing
by: Željka Boček, et al.
Published: (2025-01-01) -
Kinetics of Photodegradation and Durability of Inkjet Prints: A Comparative Study of Aqueous Solutions and Printed Substrates
by: Barbara Blaznik, et al.
Published: (2025-02-01)