Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution

Wafer-baking ovens are machines that bake liquid batter by heating the interconnected cast plates in a gas oven. The plates in contact with the wafer batter are generally made of the cast material. Although there are many studies on the contents in the recipes of wafer products and the effects of th...

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Main Authors: Uğur Köklü, Abdullah Sadık Tazegül, Fatih Serin, Gültekin Basmacı
Format: Article
Language:English
Published: MDPI AG 2025-01-01
Series:Applied Sciences
Subjects:
Online Access:https://www.mdpi.com/2076-3417/15/1/466
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author Uğur Köklü
Abdullah Sadık Tazegül
Fatih Serin
Gültekin Basmacı
author_facet Uğur Köklü
Abdullah Sadık Tazegül
Fatih Serin
Gültekin Basmacı
author_sort Uğur Köklü
collection DOAJ
description Wafer-baking ovens are machines that bake liquid batter by heating the interconnected cast plates in a gas oven. The plates in contact with the wafer batter are generally made of the cast material. Although there are many studies on the contents in the recipes of wafer products and the effects of the additives included in the recipes on the quality of the wafer sheet, there are few studies on the effects of the material type of the wafer-baking plate on the baking process. In this study, the thermal distribution of two baking plates made of different materials (GG-25 gray cast iron and GJV-350 vermicular cast iron), their effects on the thickness of the wafer sheet, and their effects on the color distribution of the wafer sheet were investigated at different baking rates. The experiments were conducted in an industrial wafer-baking oven at two different production rates. As a result, it was observed that the GJV-350 vermicular casting plate provides a more homogeneous heat distribution, more stable wafer sheet thickness, and more homogeneous color distribution of the wafer sheet at a maximum production rate.
format Article
id doaj-art-29a305c94e144fd1906f7eaed8d58d07
institution Kabale University
issn 2076-3417
language English
publishDate 2025-01-01
publisher MDPI AG
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series Applied Sciences
spelling doaj-art-29a305c94e144fd1906f7eaed8d58d072025-01-10T13:15:39ZengMDPI AGApplied Sciences2076-34172025-01-0115146610.3390/app15010466Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color DistributionUğur Köklü0Abdullah Sadık Tazegül1Fatih Serin2Gültekin Basmacı3Department of Mechanical Engineering, Faculty of Engineering, Karamanoğlu Mehmetbey University, 70100 Karaman, TürkiyeTüfekçioğulları Machinery Food Manufacturing Industry Limited Company R&D Center, Organized Industrial Zone, 70200 Karaman, TürkiyeTüfekçioğulları Machinery Food Manufacturing Industry Limited Company R&D Center, Organized Industrial Zone, 70200 Karaman, TürkiyeDepartment of Mechanical Engineering, Faculty of Engineering and Architecture, Mehmet Akif Ersoy University, 15200 Burdur, TurkeyWafer-baking ovens are machines that bake liquid batter by heating the interconnected cast plates in a gas oven. The plates in contact with the wafer batter are generally made of the cast material. Although there are many studies on the contents in the recipes of wafer products and the effects of the additives included in the recipes on the quality of the wafer sheet, there are few studies on the effects of the material type of the wafer-baking plate on the baking process. In this study, the thermal distribution of two baking plates made of different materials (GG-25 gray cast iron and GJV-350 vermicular cast iron), their effects on the thickness of the wafer sheet, and their effects on the color distribution of the wafer sheet were investigated at different baking rates. The experiments were conducted in an industrial wafer-baking oven at two different production rates. As a result, it was observed that the GJV-350 vermicular casting plate provides a more homogeneous heat distribution, more stable wafer sheet thickness, and more homogeneous color distribution of the wafer sheet at a maximum production rate.https://www.mdpi.com/2076-3417/15/1/466wafer-baking ovenwafer productionwafer-baking platecast ironswafer sheets
spellingShingle Uğur Köklü
Abdullah Sadık Tazegül
Fatih Serin
Gültekin Basmacı
Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution
Applied Sciences
wafer-baking oven
wafer production
wafer-baking plate
cast irons
wafer sheets
title Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution
title_full Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution
title_fullStr Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution
title_full_unstemmed Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution
title_short Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution
title_sort investigation of the effects of wafer baking plates on thermal distribution wafer thickness and wafer color distribution
topic wafer-baking oven
wafer production
wafer-baking plate
cast irons
wafer sheets
url https://www.mdpi.com/2076-3417/15/1/466
work_keys_str_mv AT ugurkoklu investigationoftheeffectsofwaferbakingplatesonthermaldistributionwaferthicknessandwafercolordistribution
AT abdullahsadıktazegul investigationoftheeffectsofwaferbakingplatesonthermaldistributionwaferthicknessandwafercolordistribution
AT fatihserin investigationoftheeffectsofwaferbakingplatesonthermaldistributionwaferthicknessandwafercolordistribution
AT gultekinbasmacı investigationoftheeffectsofwaferbakingplatesonthermaldistributionwaferthicknessandwafercolordistribution