Köklü, U., Tazegül, A. S., Serin, F., & Basmacı, G. Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution. MDPI AG.
Chicago Style (17th ed.) CitationKöklü, Uğur, Abdullah Sadık Tazegül, Fatih Serin, and Gültekin Basmacı. Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution. MDPI AG.
MLA (9th ed.) CitationKöklü, Uğur, et al. Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution. MDPI AG.
Warning: These citations may not always be 100% accurate.