Bioinspired thermally conducting packaging for heat management of high performance electronic chips
Abstract Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Here we propose and fabricate a closed high-conducting heat chip package based on passive phase change, using silico...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2025-01-01
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| Series: | Communications Engineering |
| Online Access: | https://doi.org/10.1038/s44172-024-00338-6 |
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