Bioinspired thermally conducting packaging for heat management of high performance electronic chips
Abstract Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Here we propose and fabricate a closed high-conducting heat chip package based on passive phase change, using silico...
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| Format: | Article |
| Language: | English |
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Nature Portfolio
2025-01-01
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| Series: | Communications Engineering |
| Online Access: | https://doi.org/10.1038/s44172-024-00338-6 |
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| _version_ | 1841559341867466752 |
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| author | Huawei Wang Pengfei Bai He Cui Xiaotong Zhang Yifan Tang Shaoyu Liang Shixiao Li Guofu Zhou |
| author_facet | Huawei Wang Pengfei Bai He Cui Xiaotong Zhang Yifan Tang Shaoyu Liang Shixiao Li Guofu Zhou |
| author_sort | Huawei Wang |
| collection | DOAJ |
| description | Abstract Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Here we propose and fabricate a closed high-conducting heat chip package based on passive phase change, using silicon carbide which is physically and structurally compatible with chip die materials. Our “chip on vapor chamber” (CoVC) concept realizes rapid diffusion of hot spots, and eliminates the high energy consumption of refrigeration ordinarily required for heat management. Multi-scale wicks and bionic vein structures are applied to CoVC leading to an increase of 164% in heat transfer performance. The thermal resistance of the package was only a third that of traditional packaging systems. This means that the structure of CoVC has a good thermal conducting ability and can reduce energy consumption for heat dissipation. |
| format | Article |
| id | doaj-art-1ea2dab988a2416fb7d8f54c08c297b1 |
| institution | Kabale University |
| issn | 2731-3395 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | Nature Portfolio |
| record_format | Article |
| series | Communications Engineering |
| spelling | doaj-art-1ea2dab988a2416fb7d8f54c08c297b12025-01-05T12:31:54ZengNature PortfolioCommunications Engineering2731-33952025-01-01411910.1038/s44172-024-00338-6Bioinspired thermally conducting packaging for heat management of high performance electronic chipsHuawei Wang0Pengfei Bai1He Cui2Xiaotong Zhang3Yifan Tang4Shaoyu Liang5Shixiao Li6Guofu Zhou7Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal UniversityGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal UniversityGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal UniversityGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal UniversityGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal UniversityGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal UniversityGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal UniversityGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal UniversityAbstract Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Here we propose and fabricate a closed high-conducting heat chip package based on passive phase change, using silicon carbide which is physically and structurally compatible with chip die materials. Our “chip on vapor chamber” (CoVC) concept realizes rapid diffusion of hot spots, and eliminates the high energy consumption of refrigeration ordinarily required for heat management. Multi-scale wicks and bionic vein structures are applied to CoVC leading to an increase of 164% in heat transfer performance. The thermal resistance of the package was only a third that of traditional packaging systems. This means that the structure of CoVC has a good thermal conducting ability and can reduce energy consumption for heat dissipation.https://doi.org/10.1038/s44172-024-00338-6 |
| spellingShingle | Huawei Wang Pengfei Bai He Cui Xiaotong Zhang Yifan Tang Shaoyu Liang Shixiao Li Guofu Zhou Bioinspired thermally conducting packaging for heat management of high performance electronic chips Communications Engineering |
| title | Bioinspired thermally conducting packaging for heat management of high performance electronic chips |
| title_full | Bioinspired thermally conducting packaging for heat management of high performance electronic chips |
| title_fullStr | Bioinspired thermally conducting packaging for heat management of high performance electronic chips |
| title_full_unstemmed | Bioinspired thermally conducting packaging for heat management of high performance electronic chips |
| title_short | Bioinspired thermally conducting packaging for heat management of high performance electronic chips |
| title_sort | bioinspired thermally conducting packaging for heat management of high performance electronic chips |
| url | https://doi.org/10.1038/s44172-024-00338-6 |
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