APA (7th ed.) Citation

Wang, H., Bai, P., Cui, H., Zhang, X., Tang, Y., Liang, S., . . . Zhou, G. Bioinspired thermally conducting packaging for heat management of high performance electronic chips. Nature Portfolio.

Chicago Style (17th ed.) Citation

Wang, Huawei, Pengfei Bai, He Cui, Xiaotong Zhang, Yifan Tang, Shaoyu Liang, Shixiao Li, and Guofu Zhou. Bioinspired Thermally Conducting Packaging for Heat Management of High Performance Electronic Chips. Nature Portfolio.

MLA (9th ed.) Citation

Wang, Huawei, et al. Bioinspired Thermally Conducting Packaging for Heat Management of High Performance Electronic Chips. Nature Portfolio.