A ligand oxidation structure-adaptive strategy for copper passivation
Abstract Despite enormous efforts, copper corrosion remains a key inducement causing huge economic losses in electrical, construction, and military industries, and deteriorates the performance of semiconductor devices. Here we show that a set of ligands functionalized with both catechol and aromatic...
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| Main Authors: | , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2025-08-01
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| Series: | Nature Communications |
| Online Access: | https://doi.org/10.1038/s41467-025-62603-2 |
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| Summary: | Abstract Despite enormous efforts, copper corrosion remains a key inducement causing huge economic losses in electrical, construction, and military industries, and deteriorates the performance of semiconductor devices. Here we show that a set of ligands functionalized with both catechol and aromatic amine groups achieves environmentally-adaptive copper passivation and fully preserves the intrinsic electrical and thermal conductivities of copper and its alloys. The oxidation of ligands in corrosive environments causes the structure-adaptation of the passivation layer, further enhancing the corrosion resistance to harsh environments including alkali and salt solutions, thermal treatment, and UV-light- and oxygen-enriched conditions. Simply adsorbing these ligands on the surface of copper, brass, copper powder, copper-based flexible printed circuits, and copper inks for flexible electronics results in strong liquid and air anticorrosion performances. Our copper passivation technique only requires a room temperature soaking procedure, providing a high industrialization possibility for copper protection, particularly in semiconductor electronics and flexible electronics. |
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| ISSN: | 2041-1723 |