APA (7th ed.) Citation

Li, S., Wang, X., Liao, M., Li, Z., Li, Q., Yan, H., . . . Wang, F. Microstructures, mechanical properties and reliability induced from size effect in Sn-based solder joints: Review. Elsevier.

Chicago Style (17th ed.) Citation

Li, Sijin, Xiaowei Wang, Mingqing Liao, Zezheng Li, Qi Li, Han Yan, Aidong Liu, and Fengjiang Wang. Microstructures, Mechanical Properties and Reliability Induced from Size Effect in Sn-based Solder Joints: Review. Elsevier.

MLA (9th ed.) Citation

Li, Sijin, et al. Microstructures, Mechanical Properties and Reliability Induced from Size Effect in Sn-based Solder Joints: Review. Elsevier.