Accelerated TLPD bonding of reliable IMCs micro joints using Cu–8Ni substrate under thermal gradient: Experiments and theoretical calculations
With the rapid development of the third-generation semiconductor power device towards high density, high performance, miniaturization and high temperature resistance, it is now urgent to develop a transient liquid phase diffusion (TLPD) bonding method with short bonding time and high reliability. In...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425000572 |
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