APA (7th ed.) Citation

Lai, Y., Wang, M., Zheng, D., Liu, M., Chen, B., Lv, J., & Zhao, N. Accelerated TLPD bonding of reliable IMCs micro joints using Cu–8Ni substrate under thermal gradient: Experiments and theoretical calculations. Elsevier.

Chicago Style (17th ed.) Citation

Lai, Yanqing, Mingjie Wang, Donghui Zheng, Meiping Liu, Bao Chen, Jinmei Lv, and Ning Zhao. Accelerated TLPD Bonding of Reliable IMCs Micro Joints Using Cu–8Ni Substrate Under Thermal Gradient: Experiments and Theoretical Calculations. Elsevier.

MLA (9th ed.) Citation

Lai, Yanqing, et al. Accelerated TLPD Bonding of Reliable IMCs Micro Joints Using Cu–8Ni Substrate Under Thermal Gradient: Experiments and Theoretical Calculations. Elsevier.