Ni mesh-reinforced ultrasonic-assisted Cu/Sn58Bi/Cu joint performance: Experiments and first-principles calculations
The Ni mesh was incorporated into the Cu/Sn58Bi/Cu bonding as a reinforcing skeleton to achieve an enhancement effect analogous to steel reinforcement in concrete. Ultrasonic-assisted soldering (UAS) improved the metallurgical bond among the solder, Ni mesh, and substrate. It facilitated the formati...
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| Format: | Article |
| Language: | English |
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Elsevier
2024-12-01
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| Series: | Ultrasonics Sonochemistry |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S1350417724003675 |
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| _version_ | 1846160378726187008 |
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| author | Xi Huang Liang Zhang Yu-hao Chen Lei Sun Xin-quan Yu Quan-bin Lu |
| author_facet | Xi Huang Liang Zhang Yu-hao Chen Lei Sun Xin-quan Yu Quan-bin Lu |
| author_sort | Xi Huang |
| collection | DOAJ |
| description | The Ni mesh was incorporated into the Cu/Sn58Bi/Cu bonding as a reinforcing skeleton to achieve an enhancement effect analogous to steel reinforcement in concrete. Ultrasonic-assisted soldering (UAS) improved the metallurgical bond among the solder, Ni mesh, and substrate. It facilitated the formation of (Cu, Ni)6Sn5 intermetallic compounds (IMCs) layers, increasing the joint strength. Observations indicated that ultrasonic treatment effectively refined the (Cu, Ni)6Sn5 grains and induced a uniform preferred orientation of β-Sn and Bi grains in the joint matrix adjacent to the Ni mesh. The shear strength of the joint reached 72.23 MPa when the ultrasonic application was sustained for 15 s, achieving the fabrication of a high-strength point with low energy consumption. First-principles calculations have confirmed that changes in the Ni content within (Cu, Ni)6Sn5 IMCs improved the stability of the crystal structure. Furthermore, the variations in content could potentially improve the mechanical and electrical properties of the (Cu, Ni)6Sn5. Enhancements in ultrasonic efficiency and the reinforcement of IMC structures offer new avenues for research in green and high-performance electronic packaging material joining technologies. |
| format | Article |
| id | doaj-art-1630e47ae5174906b5395e2f00605b5b |
| institution | Kabale University |
| issn | 1350-4177 |
| language | English |
| publishDate | 2024-12-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Ultrasonics Sonochemistry |
| spelling | doaj-art-1630e47ae5174906b5395e2f00605b5b2024-11-22T07:36:47ZengElsevierUltrasonics Sonochemistry1350-41772024-12-01111107119Ni mesh-reinforced ultrasonic-assisted Cu/Sn58Bi/Cu joint performance: Experiments and first-principles calculationsXi Huang0Liang Zhang1Yu-hao Chen2Lei Sun3Xin-quan Yu4Quan-bin Lu5School of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361000, ChinaSchool of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361000, China; Corresponding authors.School of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361000, China; Corresponding authors.School of Mechanical Engineering and Rail Transit, Changzhou University, Changzhou 213164, ChinaState Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, ChinaState Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, ChinaThe Ni mesh was incorporated into the Cu/Sn58Bi/Cu bonding as a reinforcing skeleton to achieve an enhancement effect analogous to steel reinforcement in concrete. Ultrasonic-assisted soldering (UAS) improved the metallurgical bond among the solder, Ni mesh, and substrate. It facilitated the formation of (Cu, Ni)6Sn5 intermetallic compounds (IMCs) layers, increasing the joint strength. Observations indicated that ultrasonic treatment effectively refined the (Cu, Ni)6Sn5 grains and induced a uniform preferred orientation of β-Sn and Bi grains in the joint matrix adjacent to the Ni mesh. The shear strength of the joint reached 72.23 MPa when the ultrasonic application was sustained for 15 s, achieving the fabrication of a high-strength point with low energy consumption. First-principles calculations have confirmed that changes in the Ni content within (Cu, Ni)6Sn5 IMCs improved the stability of the crystal structure. Furthermore, the variations in content could potentially improve the mechanical and electrical properties of the (Cu, Ni)6Sn5. Enhancements in ultrasonic efficiency and the reinforcement of IMC structures offer new avenues for research in green and high-performance electronic packaging material joining technologies.http://www.sciencedirect.com/science/article/pii/S1350417724003675Ni meshSn58Bi solderUltrasonic-assisted solderingFirst-principles calculations |
| spellingShingle | Xi Huang Liang Zhang Yu-hao Chen Lei Sun Xin-quan Yu Quan-bin Lu Ni mesh-reinforced ultrasonic-assisted Cu/Sn58Bi/Cu joint performance: Experiments and first-principles calculations Ultrasonics Sonochemistry Ni mesh Sn58Bi solder Ultrasonic-assisted soldering First-principles calculations |
| title | Ni mesh-reinforced ultrasonic-assisted Cu/Sn58Bi/Cu joint performance: Experiments and first-principles calculations |
| title_full | Ni mesh-reinforced ultrasonic-assisted Cu/Sn58Bi/Cu joint performance: Experiments and first-principles calculations |
| title_fullStr | Ni mesh-reinforced ultrasonic-assisted Cu/Sn58Bi/Cu joint performance: Experiments and first-principles calculations |
| title_full_unstemmed | Ni mesh-reinforced ultrasonic-assisted Cu/Sn58Bi/Cu joint performance: Experiments and first-principles calculations |
| title_short | Ni mesh-reinforced ultrasonic-assisted Cu/Sn58Bi/Cu joint performance: Experiments and first-principles calculations |
| title_sort | ni mesh reinforced ultrasonic assisted cu sn58bi cu joint performance experiments and first principles calculations |
| topic | Ni mesh Sn58Bi solder Ultrasonic-assisted soldering First-principles calculations |
| url | http://www.sciencedirect.com/science/article/pii/S1350417724003675 |
| work_keys_str_mv | AT xihuang nimeshreinforcedultrasonicassistedcusn58bicujointperformanceexperimentsandfirstprinciplescalculations AT liangzhang nimeshreinforcedultrasonicassistedcusn58bicujointperformanceexperimentsandfirstprinciplescalculations AT yuhaochen nimeshreinforcedultrasonicassistedcusn58bicujointperformanceexperimentsandfirstprinciplescalculations AT leisun nimeshreinforcedultrasonicassistedcusn58bicujointperformanceexperimentsandfirstprinciplescalculations AT xinquanyu nimeshreinforcedultrasonicassistedcusn58bicujointperformanceexperimentsandfirstprinciplescalculations AT quanbinlu nimeshreinforcedultrasonicassistedcusn58bicujointperformanceexperimentsandfirstprinciplescalculations |