Peisheng, S. C. Y. L. T. L. L. Study on the Stress and Warpage of Flip Chip Package Under Current Crowding. Editorial Department of Journal of Nantong University (Natural Science Edition).
Chicago Style (17th ed.) CitationPeisheng, SHE Chenhui; YANG Longlong; TAN Lipeng; LIU. Study on the Stress and Warpage of Flip Chip Package Under Current Crowding. Editorial Department of Journal of Nantong University (Natural Science Edition).
MLA (9th ed.) CitationPeisheng, SHE Chenhui; YANG Longlong; TAN Lipeng; LIU. Study on the Stress and Warpage of Flip Chip Package Under Current Crowding. Editorial Department of Journal of Nantong University (Natural Science Edition).
Warning: These citations may not always be 100% accurate.