Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device Technologies

Abstract Gallium oxide (Ga2O3) is an emerging ultra‐wide bandgap (UWBG) semiconductor material that has gained significant attention in the field of high voltage and high frequency power electronics. Its noteworthy attributes include a large bandgap (Eg) of 4.8 eV, high theoretical critical breakdow...

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Main Authors: Sihan Sun, Chenlu Wang, Sami Alghamdi, Hong Zhou, Yue Hao, Jincheng Zhang
Format: Article
Language:English
Published: Wiley-VCH 2025-01-01
Series:Advanced Electronic Materials
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Online Access:https://doi.org/10.1002/aelm.202300844
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author Sihan Sun
Chenlu Wang
Sami Alghamdi
Hong Zhou
Yue Hao
Jincheng Zhang
author_facet Sihan Sun
Chenlu Wang
Sami Alghamdi
Hong Zhou
Yue Hao
Jincheng Zhang
author_sort Sihan Sun
collection DOAJ
description Abstract Gallium oxide (Ga2O3) is an emerging ultra‐wide bandgap (UWBG) semiconductor material that has gained significant attention in the field of high voltage and high frequency power electronics. Its noteworthy attributes include a large bandgap (Eg) of 4.8 eV, high theoretical critical breakdown field strength (EC) of 8 MV cm−1, and saturation velocity (νs) of 2 × 107 cm s−1, as well as high Baliga figures of merit (BFOM) of 3000. In addition, Ga2O3 has the advantages of large‐size substrates that can be achieved by low‐cost melt‐grown techniques. This review provides a partial overview of pivotal milestones and recent advancements in the Ga2O3 material growth and device performance. It begins with a discussion of the fundamental material properties of Ga2O3, followed by a description of substrate growth and epitaxial techniques for Ga2O3. Subsequently, the contact technologies between Ga2O3 and other materials are fully elucidated. Moreover, this article also culminates with a detailed analysis of Ga2O3‐based high voltage and high frequency power devices. Some challenges and solutions, such as the lack of p‐type doping, low thermal conductivity, and low mobility are also presented and investigated in this review.
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series Advanced Electronic Materials
spelling doaj-art-0df14cb41c8a47ef879bc3075194ab512025-01-10T13:40:16ZengWiley-VCHAdvanced Electronic Materials2199-160X2025-01-01111n/an/a10.1002/aelm.202300844Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device TechnologiesSihan Sun0Chenlu Wang1Sami Alghamdi2Hong Zhou3Yue Hao4Jincheng Zhang5National Key Laboratory of Wide Bandgap Semiconductor Devices and Integrated Technology, School of Microelectronics Xidian University Xi'an 710071 ChinaNational Key Laboratory of Wide Bandgap Semiconductor Devices and Integrated Technology, School of Microelectronics Xidian University Xi'an 710071 ChinaDepartment of Electrical and Computer EngineeringKing Abdulaziz UniversityJeddah 21589 Saudi ArabiaNational Key Laboratory of Wide Bandgap Semiconductor Devices and Integrated Technology, School of Microelectronics Xidian University Xi'an 710071 ChinaNational Key Laboratory of Wide Bandgap Semiconductor Devices and Integrated Technology, School of Microelectronics Xidian University Xi'an 710071 ChinaNational Key Laboratory of Wide Bandgap Semiconductor Devices and Integrated Technology, School of Microelectronics Xidian University Xi'an 710071 ChinaAbstract Gallium oxide (Ga2O3) is an emerging ultra‐wide bandgap (UWBG) semiconductor material that has gained significant attention in the field of high voltage and high frequency power electronics. Its noteworthy attributes include a large bandgap (Eg) of 4.8 eV, high theoretical critical breakdown field strength (EC) of 8 MV cm−1, and saturation velocity (νs) of 2 × 107 cm s−1, as well as high Baliga figures of merit (BFOM) of 3000. In addition, Ga2O3 has the advantages of large‐size substrates that can be achieved by low‐cost melt‐grown techniques. This review provides a partial overview of pivotal milestones and recent advancements in the Ga2O3 material growth and device performance. It begins with a discussion of the fundamental material properties of Ga2O3, followed by a description of substrate growth and epitaxial techniques for Ga2O3. Subsequently, the contact technologies between Ga2O3 and other materials are fully elucidated. Moreover, this article also culminates with a detailed analysis of Ga2O3‐based high voltage and high frequency power devices. Some challenges and solutions, such as the lack of p‐type doping, low thermal conductivity, and low mobility are also presented and investigated in this review.https://doi.org/10.1002/aelm.202300844diodesepitaxialFETsGa2O3PFOMRF
spellingShingle Sihan Sun
Chenlu Wang
Sami Alghamdi
Hong Zhou
Yue Hao
Jincheng Zhang
Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device Technologies
Advanced Electronic Materials
diodes
epitaxial
FETs
Ga2O3
PFOM
RF
title Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device Technologies
title_full Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device Technologies
title_fullStr Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device Technologies
title_full_unstemmed Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device Technologies
title_short Recent Advanced Ultra‐Wide Bandgap β‐Ga2O3 Material and Device Technologies
title_sort recent advanced ultra wide bandgap β ga2o3 material and device technologies
topic diodes
epitaxial
FETs
Ga2O3
PFOM
RF
url https://doi.org/10.1002/aelm.202300844
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AT chenluwang recentadvancedultrawidebandgapbga2o3materialanddevicetechnologies
AT samialghamdi recentadvancedultrawidebandgapbga2o3materialanddevicetechnologies
AT hongzhou recentadvancedultrawidebandgapbga2o3materialanddevicetechnologies
AT yuehao recentadvancedultrawidebandgapbga2o3materialanddevicetechnologies
AT jinchengzhang recentadvancedultrawidebandgapbga2o3materialanddevicetechnologies