A novel modeling and analysis of mechanical properties of single-component thermal conductive silica gel
Abstract Single-component thermal conductive silica gel (S-TCSG) is a new type of thermal conductive material for packaging electronic components in high-performance printed circuit boards. Its mechanical properties can lead to excessive deformation of printed circuit boards or even solder joint fra...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2025-04-01
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| Series: | Scientific Reports |
| Subjects: | |
| Online Access: | https://doi.org/10.1038/s41598-025-99953-2 |
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