A novel modeling and analysis of mechanical properties of single-component thermal conductive silica gel
Abstract Single-component thermal conductive silica gel (S-TCSG) is a new type of thermal conductive material for packaging electronic components in high-performance printed circuit boards. Its mechanical properties can lead to excessive deformation of printed circuit boards or even solder joint fra...
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| Format: | Article |
| Language: | English |
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Nature Portfolio
2025-04-01
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| Series: | Scientific Reports |
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| Online Access: | https://doi.org/10.1038/s41598-025-99953-2 |
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| author | Yuezhen Wang Xiaoguang Li Zhifeng Liu Zhichao Jiang Zhijie Li Ying Li |
| author_facet | Yuezhen Wang Xiaoguang Li Zhifeng Liu Zhichao Jiang Zhijie Li Ying Li |
| author_sort | Yuezhen Wang |
| collection | DOAJ |
| description | Abstract Single-component thermal conductive silica gel (S-TCSG) is a new type of thermal conductive material for packaging electronic components in high-performance printed circuit boards. Its mechanical properties can lead to excessive deformation of printed circuit boards or even solder joint fracture during screw fastening or falling. In this paper, an experimental program was developed to study the mechanical properties of the S-TCSG, such as cushioning property, creep and stress relaxation. The relationship model is established between cushioning coefficient, compression stress and compression strain on the basis of the compression stress-strain test. In addition, the time-varying laws of the compression creep and stress relaxation of the S-TCSG were studied experimentally. The elastic modulus, relaxation modulus and creep compliance can be obtained based on the experimental data. A nonlinear finite element model (FEM) of the S-TCSG is established. Furthermore, the influence of gel thickness on stress distribution is analyzed in screw tightening. A mathematical model is proposed to characterize the relationship between gel thickness, compressive stress and displacement load. This study is of great practical significance to the rationality of coating thickness of the S-TCSG and the performance improvement of printed circuit boards. |
| format | Article |
| id | doaj-art-0c87803c9f1243e6af04e6eabffc4012 |
| institution | Kabale University |
| issn | 2045-2322 |
| language | English |
| publishDate | 2025-04-01 |
| publisher | Nature Portfolio |
| record_format | Article |
| series | Scientific Reports |
| spelling | doaj-art-0c87803c9f1243e6af04e6eabffc40122025-08-20T03:52:19ZengNature PortfolioScientific Reports2045-23222025-04-0115112010.1038/s41598-025-99953-2A novel modeling and analysis of mechanical properties of single-component thermal conductive silica gelYuezhen Wang0Xiaoguang Li1Zhifeng Liu2Zhichao Jiang3Zhijie Li4Ying Li5School of Liberal Arts and Sciences, North China Institute of Aerospace EngineeringSchool of Mechanical and Electrical Engineering, North China Institute of Aerospace EngineeringKey Laboratory of CNC Equipment Reliability, Ministry of Education, School of Mechanical and Aerospace Engineering, Jilin UniversitySchool of Liberal Arts and Sciences, North China Institute of Aerospace EngineeringSchool of Mechanical and Electrical Engineering, North China Institute of Aerospace EngineeringInstitute of Advanced Manufacturing and Intelligent Technology, Faculty of Materials and Manufacturing, Beijing University of TechnologyAbstract Single-component thermal conductive silica gel (S-TCSG) is a new type of thermal conductive material for packaging electronic components in high-performance printed circuit boards. Its mechanical properties can lead to excessive deformation of printed circuit boards or even solder joint fracture during screw fastening or falling. In this paper, an experimental program was developed to study the mechanical properties of the S-TCSG, such as cushioning property, creep and stress relaxation. The relationship model is established between cushioning coefficient, compression stress and compression strain on the basis of the compression stress-strain test. In addition, the time-varying laws of the compression creep and stress relaxation of the S-TCSG were studied experimentally. The elastic modulus, relaxation modulus and creep compliance can be obtained based on the experimental data. A nonlinear finite element model (FEM) of the S-TCSG is established. Furthermore, the influence of gel thickness on stress distribution is analyzed in screw tightening. A mathematical model is proposed to characterize the relationship between gel thickness, compressive stress and displacement load. This study is of great practical significance to the rationality of coating thickness of the S-TCSG and the performance improvement of printed circuit boards.https://doi.org/10.1038/s41598-025-99953-2Bolted jointsSingle-component thermal conductive silica gelCushioning propertyCreepStress relaxation |
| spellingShingle | Yuezhen Wang Xiaoguang Li Zhifeng Liu Zhichao Jiang Zhijie Li Ying Li A novel modeling and analysis of mechanical properties of single-component thermal conductive silica gel Scientific Reports Bolted joints Single-component thermal conductive silica gel Cushioning property Creep Stress relaxation |
| title | A novel modeling and analysis of mechanical properties of single-component thermal conductive silica gel |
| title_full | A novel modeling and analysis of mechanical properties of single-component thermal conductive silica gel |
| title_fullStr | A novel modeling and analysis of mechanical properties of single-component thermal conductive silica gel |
| title_full_unstemmed | A novel modeling and analysis of mechanical properties of single-component thermal conductive silica gel |
| title_short | A novel modeling and analysis of mechanical properties of single-component thermal conductive silica gel |
| title_sort | novel modeling and analysis of mechanical properties of single component thermal conductive silica gel |
| topic | Bolted joints Single-component thermal conductive silica gel Cushioning property Creep Stress relaxation |
| url | https://doi.org/10.1038/s41598-025-99953-2 |
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