Fluid drawing printing 3D conductive structures for flexible circuit manufacturing
Abstract Three-dimensional (3D) conductive structures significantly reduce flexible circuit complexity and enhance circuit integration. Direct extrusion printing technology offers the advantages of various material applicability and high flexibility for fabricating filamentary interconnects. The pri...
Saved in:
| Main Authors: | , , , , , , , , , , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Nature Publishing Group
2025-05-01
|
| Series: | Microsystems & Nanoengineering |
| Online Access: | https://doi.org/10.1038/s41378-025-00936-0 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1849326900482146304 |
|---|---|
| author | Yikang Li Dazhi Wang Yiwen Feng Xiangji Chen Xu Chen Chang Liu Yanteng Li Liujia Suo Ran Zhang Xiaopeng Zhang Ben Liu Fengshu Wang Shiwen Liang Lingjie Kong Qiang Fu Tongqun Ren Tiesheng Wang |
| author_facet | Yikang Li Dazhi Wang Yiwen Feng Xiangji Chen Xu Chen Chang Liu Yanteng Li Liujia Suo Ran Zhang Xiaopeng Zhang Ben Liu Fengshu Wang Shiwen Liang Lingjie Kong Qiang Fu Tongqun Ren Tiesheng Wang |
| author_sort | Yikang Li |
| collection | DOAJ |
| description | Abstract Three-dimensional (3D) conductive structures significantly reduce flexible circuit complexity and enhance circuit integration. Direct extrusion printing technology offers the advantages of various material applicability and high flexibility for fabricating filamentary interconnects. The printing resolution is, however, highly dependent on the needle size. A micro-printing method was proposed based on fluid drawing to fabricate freestanding 3D conductive structures. The delicate structure is drawn out under the tension when printing. The printing material is a high-viscosity ink composed of silver nanoparticles (AgNPs) and polyvinylpyrrolidone (PVP). The viscosity is controlled by evaporating the ink’s solvent for drawing prints. This unique printing method utilizes a single needle, controlled by precise air pressure and speed, to construct 3D filamentary structures with varied wire widths. The 3D conductive structures exhibit superior structural retention and enhanced conductivity by thermal treatment. The drawing printing method has been successfully implemented on flexible circuits, including light-emitting diode (LED) arrays, thermal imaging displays, and multivibrator circuits. This work establishes a novel paradigm for flexible electronics manufacturing through fluid-drawing printing, achieving unprecedented customization and compatibility in fabricating 3D interconnects. |
| format | Article |
| id | doaj-art-0912c49cb63f44c3b703f99e8aae5d23 |
| institution | Kabale University |
| issn | 2055-7434 |
| language | English |
| publishDate | 2025-05-01 |
| publisher | Nature Publishing Group |
| record_format | Article |
| series | Microsystems & Nanoengineering |
| spelling | doaj-art-0912c49cb63f44c3b703f99e8aae5d232025-08-20T03:48:02ZengNature Publishing GroupMicrosystems & Nanoengineering2055-74342025-05-0111111210.1038/s41378-025-00936-0Fluid drawing printing 3D conductive structures for flexible circuit manufacturingYikang Li0Dazhi Wang1Yiwen Feng2Xiangji Chen3Xu Chen4Chang Liu5Yanteng Li6Liujia Suo7Ran Zhang8Xiaopeng Zhang9Ben Liu10Fengshu Wang11Shiwen Liang12Lingjie Kong13Qiang Fu14Tongqun Ren15Tiesheng Wang16Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyKey Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyKey Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyKey Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyKey Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyKey Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyKey Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyKey Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyKey Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyState Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of TechnologyKey Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyKey Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyNingbo Institute of Dalian University of TechnologyNingbo Institute of Dalian University of TechnologyNingbo Sunny Opotech Co., LtdKey Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyKey Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of TechnologyAbstract Three-dimensional (3D) conductive structures significantly reduce flexible circuit complexity and enhance circuit integration. Direct extrusion printing technology offers the advantages of various material applicability and high flexibility for fabricating filamentary interconnects. The printing resolution is, however, highly dependent on the needle size. A micro-printing method was proposed based on fluid drawing to fabricate freestanding 3D conductive structures. The delicate structure is drawn out under the tension when printing. The printing material is a high-viscosity ink composed of silver nanoparticles (AgNPs) and polyvinylpyrrolidone (PVP). The viscosity is controlled by evaporating the ink’s solvent for drawing prints. This unique printing method utilizes a single needle, controlled by precise air pressure and speed, to construct 3D filamentary structures with varied wire widths. The 3D conductive structures exhibit superior structural retention and enhanced conductivity by thermal treatment. The drawing printing method has been successfully implemented on flexible circuits, including light-emitting diode (LED) arrays, thermal imaging displays, and multivibrator circuits. This work establishes a novel paradigm for flexible electronics manufacturing through fluid-drawing printing, achieving unprecedented customization and compatibility in fabricating 3D interconnects.https://doi.org/10.1038/s41378-025-00936-0 |
| spellingShingle | Yikang Li Dazhi Wang Yiwen Feng Xiangji Chen Xu Chen Chang Liu Yanteng Li Liujia Suo Ran Zhang Xiaopeng Zhang Ben Liu Fengshu Wang Shiwen Liang Lingjie Kong Qiang Fu Tongqun Ren Tiesheng Wang Fluid drawing printing 3D conductive structures for flexible circuit manufacturing Microsystems & Nanoengineering |
| title | Fluid drawing printing 3D conductive structures for flexible circuit manufacturing |
| title_full | Fluid drawing printing 3D conductive structures for flexible circuit manufacturing |
| title_fullStr | Fluid drawing printing 3D conductive structures for flexible circuit manufacturing |
| title_full_unstemmed | Fluid drawing printing 3D conductive structures for flexible circuit manufacturing |
| title_short | Fluid drawing printing 3D conductive structures for flexible circuit manufacturing |
| title_sort | fluid drawing printing 3d conductive structures for flexible circuit manufacturing |
| url | https://doi.org/10.1038/s41378-025-00936-0 |
| work_keys_str_mv | AT yikangli fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT dazhiwang fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT yiwenfeng fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT xiangjichen fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT xuchen fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT changliu fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT yantengli fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT liujiasuo fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT ranzhang fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT xiaopengzhang fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT benliu fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT fengshuwang fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT shiwenliang fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT lingjiekong fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT qiangfu fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT tongqunren fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing AT tieshengwang fluiddrawingprinting3dconductivestructuresforflexiblecircuitmanufacturing |