Enhancing Quality Control: A Study on AI and Human Performance in Flip Chip Defect Detection
This study introduces an advanced defect inspection model that utilizes object detection techniques to identify defects in Flip Chip cross-section images. The model serves as a valuable tool for failure analysis (FA) engineers working with Chip-on-Wafer (CoW) products by enhancing inspection precisi...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2024-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10812716/ |
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