Non-destructive orientation mapping of die-attach lead-free solder
Thermo-mechanical fatigue poses a serious challenge to the electrical operation of power semiconductor modules, manifested by the degradation of die-attach lead-free solder. So far, orientation microscopy (OM) using electron backscatter diffraction is considered a sensitive approach to characterizin...
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| Format: | Article |
| Language: | English |
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IOP Publishing
2024-01-01
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| Series: | Applied Physics Express |
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| Online Access: | https://doi.org/10.35848/1882-0786/ad9077 |
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| _version_ | 1846156289130889216 |
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| author | Yujiro Hayashi Hidehiko Kimura |
| author_facet | Yujiro Hayashi Hidehiko Kimura |
| author_sort | Yujiro Hayashi |
| collection | DOAJ |
| description | Thermo-mechanical fatigue poses a serious challenge to the electrical operation of power semiconductor modules, manifested by the degradation of die-attach lead-free solder. So far, orientation microscopy (OM) using electron backscatter diffraction is considered a sensitive approach to characterizing the degradation of solder. However, its destructive character inhibits assessing solder inside the power modules. We propose a non-destructive OM method based on X-ray diffraction and successfully observed the changes in the orientation of the solder caused by thermo-mechanical fatigue. The proposed non-destructive OM method can facilitate the development of reliable power modules by evaluating the degradation of the solder inside the power modules. |
| format | Article |
| id | doaj-art-07d5d620b4b54218a5fc6e9f8ef6b698 |
| institution | Kabale University |
| issn | 1882-0786 |
| language | English |
| publishDate | 2024-01-01 |
| publisher | IOP Publishing |
| record_format | Article |
| series | Applied Physics Express |
| spelling | doaj-art-07d5d620b4b54218a5fc6e9f8ef6b6982024-11-26T07:46:55ZengIOP PublishingApplied Physics Express1882-07862024-01-01171111650410.35848/1882-0786/ad9077Non-destructive orientation mapping of die-attach lead-free solderYujiro Hayashi0Hidehiko Kimura1https://orcid.org/0000-0003-0031-9823Toyota Central R&D Laboratories Incorporated , Nagakute, Aichi 480-1192, JapanToyota Central R&D Laboratories Incorporated , Nagakute, Aichi 480-1192, JapanThermo-mechanical fatigue poses a serious challenge to the electrical operation of power semiconductor modules, manifested by the degradation of die-attach lead-free solder. So far, orientation microscopy (OM) using electron backscatter diffraction is considered a sensitive approach to characterizing the degradation of solder. However, its destructive character inhibits assessing solder inside the power modules. We propose a non-destructive OM method based on X-ray diffraction and successfully observed the changes in the orientation of the solder caused by thermo-mechanical fatigue. The proposed non-destructive OM method can facilitate the development of reliable power modules by evaluating the degradation of the solder inside the power modules.https://doi.org/10.35848/1882-0786/ad9077synchrotron radiation X-rayorientation mappinglead-free solderpower modules |
| spellingShingle | Yujiro Hayashi Hidehiko Kimura Non-destructive orientation mapping of die-attach lead-free solder Applied Physics Express synchrotron radiation X-ray orientation mapping lead-free solder power modules |
| title | Non-destructive orientation mapping of die-attach lead-free solder |
| title_full | Non-destructive orientation mapping of die-attach lead-free solder |
| title_fullStr | Non-destructive orientation mapping of die-attach lead-free solder |
| title_full_unstemmed | Non-destructive orientation mapping of die-attach lead-free solder |
| title_short | Non-destructive orientation mapping of die-attach lead-free solder |
| title_sort | non destructive orientation mapping of die attach lead free solder |
| topic | synchrotron radiation X-ray orientation mapping lead-free solder power modules |
| url | https://doi.org/10.35848/1882-0786/ad9077 |
| work_keys_str_mv | AT yujirohayashi nondestructiveorientationmappingofdieattachleadfreesolder AT hidehikokimura nondestructiveorientationmappingofdieattachleadfreesolder |