Non-destructive orientation mapping of die-attach lead-free solder
Thermo-mechanical fatigue poses a serious challenge to the electrical operation of power semiconductor modules, manifested by the degradation of die-attach lead-free solder. So far, orientation microscopy (OM) using electron backscatter diffraction is considered a sensitive approach to characterizin...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2024-01-01
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| Series: | Applied Physics Express |
| Subjects: | |
| Online Access: | https://doi.org/10.35848/1882-0786/ad9077 |
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| Summary: | Thermo-mechanical fatigue poses a serious challenge to the electrical operation of power semiconductor modules, manifested by the degradation of die-attach lead-free solder. So far, orientation microscopy (OM) using electron backscatter diffraction is considered a sensitive approach to characterizing the degradation of solder. However, its destructive character inhibits assessing solder inside the power modules. We propose a non-destructive OM method based on X-ray diffraction and successfully observed the changes in the orientation of the solder caused by thermo-mechanical fatigue. The proposed non-destructive OM method can facilitate the development of reliable power modules by evaluating the degradation of the solder inside the power modules. |
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| ISSN: | 1882-0786 |