Fabrication, microstructure, and properties of W–Cu graded composites
The three-layer W–Cu graded composites were prepared by powders mixing and spark plasma sintering, using W and Cu powders in different proportions as the raw materials. The microstructure, interface characteristics, physical properties, mechanical properties, and thermal shock resistance of the W–Cu...
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| Format: | Article |
| Language: | zho |
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Editorial Office of Powder Metallurgy Technology
2024-06-01
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| Series: | Fenmo yejin jishu |
| Subjects: | |
| Online Access: | https://pmt.ustb.edu.cn/article/doi/10.19591/j.cnki.cn11-1974/tf.2022020002 |
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| _version_ | 1846169169735712768 |
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| author | FENG Xiaowei SI Anheng FENG Bo LI Daren |
| author_facet | FENG Xiaowei SI Anheng FENG Bo LI Daren |
| author_sort | FENG Xiaowei |
| collection | DOAJ |
| description | The three-layer W–Cu graded composites were prepared by powders mixing and spark plasma sintering, using W and Cu powders in different proportions as the raw materials. The microstructure, interface characteristics, physical properties, mechanical properties, and thermal shock resistance of the W–Cu graded composites at different sintering temperatures were investigated. The results show that, the W–Cu graded composites sintered at 900 ℃ have the high relative density (95%) and retain the original design composition of single layer. The distribution of W and Cu in each graded layer is uniform, and the interface between W and Cu is well combined without diffusion. The mechanical properties of the W–Cu graded composites show the gradient distribution, and the microhardness of the W–40Cu layer is up to HV 136. The fracture is firstly present at the W–40Cu layer in the compression process, and the highest compressive yield strength is 378 MPa. The thermal conductivity of the W–Cu graded composite sintered at 900 ℃ is 202 W·m−1·K−1. After the thermal shock resistance test, the W–Cu gradient composites show the good thermal shock resistance performance without no crack at the interface. |
| format | Article |
| id | doaj-art-061079bba6984b64963a16fb3d9027c7 |
| institution | Kabale University |
| issn | 1001-3784 |
| language | zho |
| publishDate | 2024-06-01 |
| publisher | Editorial Office of Powder Metallurgy Technology |
| record_format | Article |
| series | Fenmo yejin jishu |
| spelling | doaj-art-061079bba6984b64963a16fb3d9027c72024-11-13T05:47:05ZzhoEditorial Office of Powder Metallurgy TechnologyFenmo yejin jishu1001-37842024-06-0142328328910.19591/j.cnki.cn11-1974/tf.2022020002Fabrication, microstructure, and properties of W–Cu graded compositesFENG Xiaowei0SI Anheng1FENG Bo2LI Daren3Guangdong Provincial Key Laboratory of Metal Toughening Technology and Application, Institute of New Materials, Guangdong Academy of Sciences, Guangzhou 510650, ChinaNational Joint Engineering Research Center for Abrasion Control and Molding of Metal Materials, Henan University of Science and Technology, Luoyang 471003, ChinaGuangdong Provincial Key Laboratory of Metal Toughening Technology and Application, Institute of New Materials, Guangdong Academy of Sciences, Guangzhou 510650, ChinaHart Sanwei (Zhongshan) Metal Materials Co., Ltd., Zhongshan 528403, ChinaThe three-layer W–Cu graded composites were prepared by powders mixing and spark plasma sintering, using W and Cu powders in different proportions as the raw materials. The microstructure, interface characteristics, physical properties, mechanical properties, and thermal shock resistance of the W–Cu graded composites at different sintering temperatures were investigated. The results show that, the W–Cu graded composites sintered at 900 ℃ have the high relative density (95%) and retain the original design composition of single layer. The distribution of W and Cu in each graded layer is uniform, and the interface between W and Cu is well combined without diffusion. The mechanical properties of the W–Cu graded composites show the gradient distribution, and the microhardness of the W–40Cu layer is up to HV 136. The fracture is firstly present at the W–40Cu layer in the compression process, and the highest compressive yield strength is 378 MPa. The thermal conductivity of the W–Cu graded composite sintered at 900 ℃ is 202 W·m−1·K−1. After the thermal shock resistance test, the W–Cu gradient composites show the good thermal shock resistance performance without no crack at the interface.https://pmt.ustb.edu.cn/article/doi/10.19591/j.cnki.cn11-1974/tf.2022020002graded compositesspark plasma sinteringmicrostructureinterface characteristicsmechanical properties |
| spellingShingle | FENG Xiaowei SI Anheng FENG Bo LI Daren Fabrication, microstructure, and properties of W–Cu graded composites Fenmo yejin jishu graded composites spark plasma sintering microstructure interface characteristics mechanical properties |
| title | Fabrication, microstructure, and properties of W–Cu graded composites |
| title_full | Fabrication, microstructure, and properties of W–Cu graded composites |
| title_fullStr | Fabrication, microstructure, and properties of W–Cu graded composites |
| title_full_unstemmed | Fabrication, microstructure, and properties of W–Cu graded composites |
| title_short | Fabrication, microstructure, and properties of W–Cu graded composites |
| title_sort | fabrication microstructure and properties of w cu graded composites |
| topic | graded composites spark plasma sintering microstructure interface characteristics mechanical properties |
| url | https://pmt.ustb.edu.cn/article/doi/10.19591/j.cnki.cn11-1974/tf.2022020002 |
| work_keys_str_mv | AT fengxiaowei fabricationmicrostructureandpropertiesofwcugradedcomposites AT sianheng fabricationmicrostructureandpropertiesofwcugradedcomposites AT fengbo fabricationmicrostructureandpropertiesofwcugradedcomposites AT lidaren fabricationmicrostructureandpropertiesofwcugradedcomposites |