Epoxy/phenolic nanocomposite based adhesives: Non-isothermal cure kinetic study

Epoxy/phenolic nanocomposite based adhesives: Non-isothermal cure kinetic study

The curing behavior of an epoxy/phenolic-based system containing graphene oxide (GO), and rubber powder as a toughening agent has been studied using differential scanning calorimetry (DSC) under non-isothermal conditions at a temperature from 0 to 200 °C. So, to better dispersion of GO nanoplates in...

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Bibliographic Details
Main Authors:	Abbas Deriszadeh, Farhad Shahraki, Loghman Mostafa, Ali B.M. Ali, Davod Mohebbi-Kalhori, Soheil Salahshour, A. Alizad
Format:	Article
Language:	English
Published:	Elsevier 2024-12-01
Series:	Results in Engineering
Subjects:	Epoxy resin Phenolic DSC Curing kinetics Adhesive Nonisothermal
Online Access:	http://www.sciencedirect.com/science/article/pii/S2590123024015664
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