Epoxy/phenolic nanocomposite based adhesives: Non-isothermal cure kinetic study
The curing behavior of an epoxy/phenolic-based system containing graphene oxide (GO), and rubber powder as a toughening agent has been studied using differential scanning calorimetry (DSC) under non-isothermal conditions at a temperature from 0 to 200 °C. So, to better dispersion of GO nanoplates in...
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| Format: | Article |
| Language: | English |
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Elsevier
2024-12-01
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| Series: | Results in Engineering |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123024015664 |
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| author | Abbas Deriszadeh Farhad Shahraki Loghman Mostafa Ali B.M. Ali Davod Mohebbi-Kalhori Soheil Salahshour A. Alizad |
| author_facet | Abbas Deriszadeh Farhad Shahraki Loghman Mostafa Ali B.M. Ali Davod Mohebbi-Kalhori Soheil Salahshour A. Alizad |
| author_sort | Abbas Deriszadeh |
| collection | DOAJ |
| description | The curing behavior of an epoxy/phenolic-based system containing graphene oxide (GO), and rubber powder as a toughening agent has been studied using differential scanning calorimetry (DSC) under non-isothermal conditions at a temperature from 0 to 200 °C. So, to better dispersion of GO nanoplates in the resin media, the surface of the GOs was modified by 1,12-diaminododecane and subsequently aforementioned reaction was confirmed by Fourier transform infrared spectroscopy (FT-IR) and thermogravimetric techniques (TGA). DSC results show that rubber powders despite toughening properties prohibited resin-curing reactions. On the other hand, modified GO led to the promotion of curing reactions. The results of differential and integral isoconversional approaches indicated low activation energy for nanocomposite containing modified GO. Furthermore, thermal stability results reveal that the maximum decomposition temperature and char yield values of samples were increased gradually by the addition of GO and rubber powder to the system. |
| format | Article |
| id | doaj-art-04704d2a59564e018411b19cb09813a8 |
| institution | Kabale University |
| issn | 2590-1230 |
| language | English |
| publishDate | 2024-12-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Results in Engineering |
| spelling | doaj-art-04704d2a59564e018411b19cb09813a82024-12-19T10:58:59ZengElsevierResults in Engineering2590-12302024-12-0124103312Epoxy/phenolic nanocomposite based adhesives: Non-isothermal cure kinetic studyAbbas Deriszadeh0Farhad Shahraki1Loghman Mostafa2Ali B.M. Ali3Davod Mohebbi-Kalhori4Soheil Salahshour5A. Alizad6Department of Chemical Engineering, University of Sistan and Baluchestan, Zahedan, IranDepartment of Chemical Engineering, University of Sistan and Baluchestan, Zahedan, IranDepartment of Medical Biochemical Analysis, College of Health Technology , Cihan University-Erbil , Erbil, IraqAir Conditioning Engineering Department, College of Engineering, University of Warith Al-Anbiyaa, Karbala, IraqDepartment of Chemical Engineering, University of Sistan and Baluchestan, Zahedan, IranFaculty of Engineering and Natural Sciences, Istanbul Okan University, Istanbul, Turkey; Faculty of Engineering and Natural Sciences, Bahcesehir University, Istanbul, Turkey; Department of Computer Science and Mathematics, Lebanese American University, Beirut, LebanonDepartment of Mechanical Engineering, College of Engineering, Urmia Azad University, Urmia, IranThe curing behavior of an epoxy/phenolic-based system containing graphene oxide (GO), and rubber powder as a toughening agent has been studied using differential scanning calorimetry (DSC) under non-isothermal conditions at a temperature from 0 to 200 °C. So, to better dispersion of GO nanoplates in the resin media, the surface of the GOs was modified by 1,12-diaminododecane and subsequently aforementioned reaction was confirmed by Fourier transform infrared spectroscopy (FT-IR) and thermogravimetric techniques (TGA). DSC results show that rubber powders despite toughening properties prohibited resin-curing reactions. On the other hand, modified GO led to the promotion of curing reactions. The results of differential and integral isoconversional approaches indicated low activation energy for nanocomposite containing modified GO. Furthermore, thermal stability results reveal that the maximum decomposition temperature and char yield values of samples were increased gradually by the addition of GO and rubber powder to the system.http://www.sciencedirect.com/science/article/pii/S2590123024015664Epoxy resinPhenolicDSCCuring kineticsAdhesiveNonisothermal |
| spellingShingle | Abbas Deriszadeh Farhad Shahraki Loghman Mostafa Ali B.M. Ali Davod Mohebbi-Kalhori Soheil Salahshour A. Alizad Epoxy/phenolic nanocomposite based adhesives: Non-isothermal cure kinetic study Results in Engineering Epoxy resin Phenolic DSC Curing kinetics Adhesive Nonisothermal |
| title | Epoxy/phenolic nanocomposite based adhesives: Non-isothermal cure kinetic study |
| title_full | Epoxy/phenolic nanocomposite based adhesives: Non-isothermal cure kinetic study |
| title_fullStr | Epoxy/phenolic nanocomposite based adhesives: Non-isothermal cure kinetic study |
| title_full_unstemmed | Epoxy/phenolic nanocomposite based adhesives: Non-isothermal cure kinetic study |
| title_short | Epoxy/phenolic nanocomposite based adhesives: Non-isothermal cure kinetic study |
| title_sort | epoxy phenolic nanocomposite based adhesives non isothermal cure kinetic study |
| topic | Epoxy resin Phenolic DSC Curing kinetics Adhesive Nonisothermal |
| url | http://www.sciencedirect.com/science/article/pii/S2590123024015664 |
| work_keys_str_mv | AT abbasderiszadeh epoxyphenolicnanocompositebasedadhesivesnonisothermalcurekineticstudy AT farhadshahraki epoxyphenolicnanocompositebasedadhesivesnonisothermalcurekineticstudy AT loghmanmostafa epoxyphenolicnanocompositebasedadhesivesnonisothermalcurekineticstudy AT alibmali epoxyphenolicnanocompositebasedadhesivesnonisothermalcurekineticstudy AT davodmohebbikalhori epoxyphenolicnanocompositebasedadhesivesnonisothermalcurekineticstudy AT soheilsalahshour epoxyphenolicnanocompositebasedadhesivesnonisothermalcurekineticstudy AT aalizad epoxyphenolicnanocompositebasedadhesivesnonisothermalcurekineticstudy |