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  1. 1
    Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

    Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem by Jiachen Xu, Mingfang Wu, Juan Pu, Songbai Xue

    Published 2020-01-01
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  2. 2
    Influence of Hydrogen Content on the Microstructure and Mechanical Properties of ER5183 Wires

    Influence of Hydrogen Content on the Microstructure and Mechanical Properties of ER5183 Wires by Yilong Han, Songbai Xue, Renli Fu, Lihao Lin, Zhongqiang Lin, Yinyin Pei, Huawei Sun

    Published 2019-01-01
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