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  1. 1
    Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect

    Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect by Shih-Chi Yang, Yu-Tao Yang, Chih Chen

    Published 2024-11-01
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  2. 2
    Evolutions of interfacial microstructures in Cu/SiO2 hybrid joints during temperature cycling tests

    Evolutions of interfacial microstructures in Cu/SiO2 hybrid joints during temperature cycling tests by Jia-Juen Ong, Dinh-Phuc Tran, Hua-Jing Huang, Wei-Lan Chiu, Shih-Chi Yang, Wen-Wei Wu, Hsiang-Hung Chiang, Chih Chen

    Published 2024-11-01
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