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    Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element

    Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element by Yizhe Cao, Bo Li, Lei Liu, Shaolong Li, Dongxu Hui, Shaodi Wang, Huiying Liu, Xin Li, Xin Zhang, Shengyin Zhou, Shufeng Li

    Published 2024-11-01
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