Showing 1 - 12 results of 12 for search 'PENG Yongdian', query time: 0.01s Refine Results
  1. 1
    Thermal Design and Simulation of High Power Press-pack IGBT Module

    Thermal Design and Simulation of High Power Press-pack IGBT Module by XIAO Hongxiu, DOU Zechun, PENG Yongdian

    Published 2016-01-01
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  2. 2
    The Investigation of Copper Metalized AlN for High Voltage IGBT Module

    The Investigation of Copper Metalized AlN for High Voltage IGBT Module by WU Yudong, WAN Zhengfen, PENG Yongdian

    Published 2012-01-01
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  3. 3
    Development of High Performance SiC Hybird Power Module

    Development of High Performance SiC Hybird Power Module by SHAO Yun, SHI Jingjing, LI Chengzhan, PENG Yongdian

    Published 2013-01-01
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  4. 4
    1 200 V Hybrid SiC Power Module with Low Stray Inductance

    1 200 V Hybrid SiC Power Module with Low Stray Inductance by LI Chengzhan, CHANG Guiqin, PENG Yongdian, FANG Jie, ZHOU Wangjun

    Published 2016-01-01
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  5. 5
    Effects of Baseplate Bow Type on Stress of IGBT Module

    Effects of Baseplate Bow Type on Stress of IGBT Module by CHANG Guiqin, DOU Zechun, PENG Yongdian, FANG Jie, ZENG Xiong

    Published 2017-01-01
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  6. 6
    Application of SiC Device in Grid-connected Photovoltaic Inverter

    Application of SiC Device in Grid-connected Photovoltaic Inverter by XIE Jingren, HONG Xiaocong, HUANG Shukun, PENG Yongdian, CHANG Guiqin

    Published 2016-01-01
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  7. 7
    Thermal Performance Analysis of High-power IGBT Module Based on ANSYS

    Thermal Performance Analysis of High-power IGBT Module Based on ANSYS by FANG Jie, CHANG Guiqin, PENG Yongdian, LI Jilu, TANG Longgu

    Published 2012-01-01
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  8. 8
    Research on Partial Discharge Behavior of AlN Substrate in High Voltage IGBT Module

    Research on Partial Discharge Behavior of AlN Substrate in High Voltage IGBT Module by FANG Jie, PENG Yongdian, DOU Zechun, CHANG Guiqin, LI Jilu, LI Shiping

    Published 2015-01-01
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  9. 9
    Effect of Solder Voids on IGBT Thermal and Stress Performance

    Effect of Solder Voids on IGBT Thermal and Stress Performance by WU Yudong, CHANG Guiqin, PENG Yongdian, FANG Jie, TANG Longgu, LI Jilu

    Published 2014-01-01
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  10. 10
    Study of the Package Degradation of IGBT Module during Thermal Cycling Test

    Study of the Package Degradation of IGBT Module during Thermal Cycling Test by XU Ninghua, PENG Yongdian, LUO Haihui, FENG Huiyu, LI Liangxing, LI Han

    Published 2016-01-01
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  11. 11
    Design and Key Technologies of High-power Press-pack IGBT Device

    Design and Key Technologies of High-power Press-pack IGBT Device by DOU Zechun, LIU Guoyou, CHEN Jun, LI Xiaolin, PENG Yongdian, LI Jilu

    Published 2016-01-01
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  12. 12
    Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle

    Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle by WANG Yangang, LIU Xuyu, DAI Xiaoping, WU Yibo, PENG Yongdian, LIU Guoyou

    Published 2017-01-01
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