Progress and prospect of packaging of high-power semiconductor modules by WANG Yangang, LUO Haihui, XIAO Qiang

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Investigation of Deep Trench Process for Trench-gate IGBT by LUO Haihui, HUANG Jianwei, DEVINY Ian, LIU Guoyou

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Research and Application of IGBT in Electric Vehicle by GUO Shuying, WANG Zhengyu, LUO Haihui, ZHANG Xuhui, WU Yibo, QIN Rongzhen

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Research on the Key Technology of Trench Gate IGBT by HUANG Jianwei, YANG Xinzhu, LIU Gen, LUO Haihui, YU Wei, TAN Canjian

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Research on Internal Current Sharing of High-power IGBTs by YU Wei, LUO Haihui, DENG Jianghui, ZHOU Wangjun, JIANG Pusheng, WU Yudong

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Study of the Package Degradation of IGBT Module during Thermal Cycling Test by XU Ninghua, PENG Yongdian, LUO Haihui, FENG Huiyu, LI Liangxing, LI Han

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Effect of P-well Interconnection in Dummy Trench Area on Properties of Trench IGBT by LUO Haihui, XIAO Qiang, YU Wei, YANG Xinzhu, TAN Canjian, HUANG Jianwei, LIU Guoyou

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