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    Heterogeneous Integration Toward a Monolithic 3-D Chip Enabled by III–V and Ge Materials

    Heterogeneous Integration Toward a Monolithic 3-D Chip Enabled by III–V and Ge Materials by Sang-Hyeon Kim, Seong-Kwang Kim, Jae-Phil Shim, Dae-Myeong Geum, Gunwu Ju, Han-Sung Kim, Hee-Jeong Lim, Hyeong-Rak Lim, Jae-Hoon Han, Subin Lee, Ho-Sung Kim, Pavlo Bidenko, Chang-Mo Kang, Dong-Seon Lee, Jin-Dong Song, Won Jun Choi, Hyung-Jun Kim

    Published 2018-01-01
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