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    A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions

    A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions by Gangli Yang, Tailong Shi, Liu Chang, Hongjia Zhu, Dongyu Tong, Wending Yang, Zeyuan Li, Liyi Li

    Published 2024-11-01
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